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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal 3-State Inverting D Flip-Flop
High-Performance Silicon-Gate CMOS
The MC74HC564 is identical in pinout to the LS564. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device is identical in function to the HC534A but has the flip-flop inputs on the opposite side of the package from the outputs to facilitate PC board layout. Data meeting the setup time is clocked, in inverted form, to the outputs with the rising edge of the Clock. The Output Enable input does not affect the states of the flip-flops, but when Output Enable is high, all device outputs are forced to the high-impedance state. Thus, data may be stored even when the outputs are not enabled. The HC564 is the inverting version of the HC574A. * * * * * * Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 282 FETs or 70.5 Equivalent Gates
20
MC74HC564
N SUFFIX PLASTIC PACKAGE CASE 738-03
1
20 1
DW SUFFIX SOIC PACKAGE CASE 751D-04
ORDERING INFORMATION MC74HCXXXN MC74HCXXXDW Plastic SOIC
PIN ASSIGNMENT
OUTPUT ENABLE D0 D1 D2 D3 D4 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 CLOCK
LOGIC DIAGRAM
2 3 4 5 6 7 8 9 11 1 PIN 20 = VCC PIN 10 = GND 19 18 17 16 15 14 13 12
D5 D6
D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 CLOCK OUTPUT ENABLE
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Output Enable L L L H INVERTING OUTPUTS
D7 GND
FUNCTION TABLE
Inputs Clock D H L X X Output Q L H No Change Z
L,H, X
X = don't care Z = high impedance
10/95
(c) Motorola, Inc. 1995
1
REV 6
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). Vin = VCC or GND 6.0 8 80 160 A Iout = 0 A NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MAXIMUM RATINGS*
MC74HC564
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
ICC
TA
IOZ
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
Storage Temperature
Power Dissipation in Still Air
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Quiescent Supply Current (per Package)
Maximum Three-State Leakage Current
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Plastic DIP SOIC Package
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND
Vin = VIH or VIL |Iout| |Iout|
Vin = VIH or VIL |Iout| |Iout|
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
v
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 2.0 Value
v 6.0 mA v 7.8 mA
v 6.0 mA v 7.8 mA
0 0 0
0
75
35
20
260
750 500
+ 125
1000 500 400
VCC
Max
6.0
VCC V
6.0
6.0
4.5 6.0
2.0 4.5 6.0
4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.5
0.1
1.5 3.15 4.2
0.26 0.26
3.98 5.48
0.1 0.1 0.1
1.9 4.4 5.9
0.3 0.9 1.2
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 5.0 1.0 1.5 3.15 4.2 0.33 0.33 3.84 5.34 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2
v
1.0 1.5 3.15 4.2 0.40 0.40 3.70 5.20 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2
10
v
Unit
A A V V V V
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Symbol tPLH, tPHL tTLH, tTHL tPZL, tPZH tPLZ, tPHZ fmax Cout Cin Maximum Three-State Output Capacitance (Output in High-Impedance State) Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Clock to Q (Figures 1 and 4) Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Parameter VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- -- - 55 to 25_C 150 30 26 150 30 26 175 35 30 6.0 30 35 15 10 60 12 10 Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Symbol
CPD
tr, tf
tsu
tw
th
Power Dissipation Capacitance (Per Flip-Flop)*
Maximum Input Rise and Fall Times (Figure 1)
Minimum Pulse Width, Clock (Figure 1)
Minimum Hold Time, Clock to Data (Figure 3)
Minimum Setup Time, Data to Clock (Figure 3)
Parameter
3 VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 55 to 25_C Typical @ 25C, VCC = 5.0 V 1000 500 400 100 20 17 80 16 14 5 5 5 Guaranteed Limit 1000 500 400 100 20 17 125 25 21 190 38 33 190 38 33 220 44 37 4.8 24 28 15 10 75 15 13 38 5 5 5 1000 500 400 120 24 20 150 30 26 225 45 38 225 45 38 265 53 45 4.0 20 24 15 10 90 18 15 5 5 5
v 85_C v 125_C
v 85_C v 125_C
MC74HC564
MOTOROLA MHz Unit Unit pF pF pF ns ns ns ns ns ns ns ns
MC74HC564
SWITCHING WAVEFORMS
tr CLOCK 90% 50% 10% tw 1/fmax tPLH Q 90% 50% 10% tTLH tTHL tPHL Q tf VCC GND OUTPUT ENABLE 50% GND tPZL 50% tPZH Q 50% tPHZ 10% 90% tPLZ HIGH IMPEDANCE VOL VOH HIGH IMPEDANCE VCC
Figure 1.
Figure 2.
VALID VCC DATA 50% GND tsu CLOCK th VCC 50% GND
Figure 3.
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
CL*
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 4.
Figure 5.
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC74HC564
EXPANDED LOGIC DIAGRAM
D0
2
D C
Q
19
Q0
D1
3
D C
Q
18
Q1
D2
4
D C
Q
17
Q2
D3
5
D C
Q
16
Q3
D4
6
D C
Q
15
Q4
D5
7
D C
Q
14
Q5
D6
8
D C
Q
13
Q6
D7
9
D C
Q
12
Q7
CLOCK
11
OUTPUT ENABLE
1
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC74HC564
OUTLINE DIMENSIONS
N SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE E
B
1 10
-A-
20 11
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
-A-
20 11
DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D-04 ISSUE E
10X
-B-
1 10
P 0.010 (0.25)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029
20X
D
M
0.010 (0.25)
TA
S
B
J
S
F R X 45 _ C -T-
18X SEATING PLANE
G
K
M
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MOTOROLA
CODELINE
6
*MC74HC564/D*
MC74HC564/D High-Speed CMOS Logic Data DL129 -- Rev 6

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